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Define, organize and validate material (polymers, inorganic dielectrics, metallurgy) & processes during development
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs and bilateral initiatives, imec contributes to the state of the art in a significant manner. Thanks to recent advances in 3D integration, wafer-level packaging and MEMS, novel types of components with small form factors and an increased number of functionalities are emerging. These novel components also require new packaging solutions. To support the growing interest in these activities, we are looking for an R&D Engineer for temporary bonding and debonding.
You are member of the Bonding, Assembly and Wafer level packaging team (BAW) of the Materials, Transfer and Assembly group (MATA) which is responsible for developing processes requested by the process integration departments running imec’s CORE and CMORE programs. You work in a group of about 25 people with whom you interact daily. You will work in a dynamic multidisciplinary and multicultural environment in close cooperation with Researchers, Scientists, Hardware Engineers, Operations, Equipment Vendors, Industrial Assignees, Device and Process experts.
You will be responsible for developing new bonding and debonding processes with the focus on 3D-heterogeneous/packaging applications (3D integrated systems, image sensors, photonics, biomedical devices, quantum computing,...). For this, you work mainly in the cleanroom, and you are supported by experienced technical staff to carry out standard operations. You will be involved in research activities where polymer characterization is required. As such, you will contribute to the generation and management of a polymer expertise center, were polymer characterization (thermo-mechanical properties) in function of applications are key.
More specifically, you will:
You will be coached on-the-job by senior researchers.
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.
We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.
IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.
The combination of our widely acclaimed leadership in microchip technology and profound software and ICT expertise is what makes us unique.
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